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US 2009/0212391 A1Published application
Micromodules Including Integrated Thin Film Inductors and Methods of Making the Same
AssigneeFairchild Semiconductor Corporation
InventorsFrancesco Carobolante, Douglas Alan Hawks
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Abstract
Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
Claims24
A micromodule comprising:
- a component substrate comprising a thin film inductor;
- and
- a bumped semiconductor die disposed on the component substrate and over the thin film inductor.
A micromodule comprising:
- a component substrate comprising a first surface, a second surface, a thin film inductor, and a plurality of vias extending between the first and second surfaces;
- a first plurality of interconnect pads disposed on the first surface of component substrate, at least two of the first plurality of interconnect pads being electrically coupled to respective vias;
- a second plurality of interconnect pads disposed on the second surface of component substrate, at least two of the second plurality of interconnect pads being electrically coupled to respective vias;
- and
- a semiconductor die disposed on the first surface of the component substrate and electrical coupled to the first plurality of interconnect pads.
2 more elements
A method of making a micromodule, the method comprising:
- assembling a component substrate comprising a thin film inductor and a semiconductor die together such that the semiconductor die is disposed over the thin film inductor;
- and
- assembling a plurality of conductive interconnect bumps on a plurality of interconnect pads disposed on the component substrate and located adjacent to one or more sides of the bumped die.
A method of making a micromodule, the method comprising:
- assembling a component substrate comprising a thin film inductor and a semiconductor die together such that the semiconductor die is disposed over a first surface of the component die;
- and
- assembling a plurality of conductive interconnect bumps on a plurality of interconnect pads disposed on a second surface of the component substrate.
Dependencies are inferred from the claim text.