Solid-state imaging device, camera module and electronic equipment module
AssigneeSony Corporation
InventorTakayuki EZAKI
Life of this patent
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AssigneeSony Corporation
InventorTakayuki EZAKI
Estimating the term…
To provide a back-illuminated type solid-state imaging device capable of color separation of pixels without using a color filter, and a camera module and an electronic equipment module which incorporate the solid-state imaging device. A solid-state imaging device including: a photoelectric conversion element PD formed in a semiconductor substrate 22; a reading-out part which reads out signal charges from the photoelectric conversion element PD formed on one surface side of the semiconductor substrate 22; the other surface of the semiconductor substrate 22 made to a light incidence surface; and a pixel which exclusively makes light of a specific wavelength or longer photoelectrically converted, by adjusting pn junction depths h2 [h2 r, h2 g, h2 b] between the photoelectric conversion element PD and an accumulation layer 28 on the light incidence surface side. A camera module and an electronic equipment module which incorporate the solid-state imaging device.
A solid-state imaging device comprising:
A camera module comprising:
An electronic equipment module comprising a solid-state imaging device, an optical lens system and a signal processing portion,
Dependencies are inferred from the claim text.