Semiconductor apparatus, manufacturing method for the semiconductor apparatus, and electronic information device
AssigneeSharp Kabushiki Kaisha
InventorYasunori Kitamura
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Abstract
A semiconductor apparatus according to the present invention includes one or a plurality of pairs of a standard pattern and an offset pattern formed therein with respect to the standard pattern as manufacturing information and other information at an information writing position, which is visible from the outside, of each semiconductor chip on a wafer.
Claims23
A semiconductor apparatus, comprising one or a plurality of pairs of a standard pattern and an offset pattern formed therein with respect to the standard pattern as manufacturing information and other information at an information writing position, which is visible from an outside, of each semiconductor chip on a wafer.
A method for manufacturing a semiconductor apparatus, the method comprising an information writing step of forming one or a plurality of pairs of a standard pattern and an offset pattern with respect to the standard pattern as manufacturing information and other information at a same layer or a different layer, which is visible from an outside, of each semiconductor chip on a wafer.
An electronic information device including the solid-state image capturing element according to claim as an image input device used in an image capturing section.
Dependencies are inferred from the claim text.