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US 2009/0212316 A1Published application
Surface-mounted optoelectronic semiconductor component and method for the production thereof
AssigneeOSRAM Opto Semiconductors GmbH
InventorsBert Braune, Herbert Brunner, Thomas Höfer, Harald Jäger, Raimund Schwarz
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Abstract
A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.
Claims44
A surface-mounted component, comprising:
- an optoelectronic semiconductor chip;
- a molded body integrally molded onto the semiconductor chips;
- a mounting area formed at least in places by a surface of the molded body;
- at least one connection location;
- and
- side areas of the component which are produced by means of singulation.
3 more elements
A method for the production of a surface-mounted optoelectronic component, comprising the steps of:
- arranging a multiplicity of optoelectronic semiconductor chips in a cavity of a compression molding die or of a casting molding die;
- encapsulating the semiconductor chips with a common molded body;
- and
- severing the molded body for singulating the components.
1 more element
Dependencies are inferred from the claim text.