US 2009/0212315 A1Published application

Semiconductor light emitting device and method for manufacturing the same

AssigneeStanley Electric Co., Ltd.

InventorHironobu Sakamoto

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Abstract

A semiconductor light emitting device is provided so that an optical axis thereof is properly set parallel with the mounting board when the device is mounted on the mounting board. The semiconductor light emitting device can have a structure in that light can be incident on the light guide plate with high efficiency and uniform introduction into the light guide plate. A multi-piece substrate can include electrodes, a plurality of semiconductor light emitting elements, and a sealing resin for sealing them simultaneously. The thus obtained integrated substrate is cut into individual semiconductor light emitting device bodies. On one of the cut end faces, which serves as a surface to be mounted onto a mounting board, a light-shielding reflective film can be coated over an area from the edge of the light emission surface of the sealing resin to at least part of the substrate. On the other cut end face, the sealing resin can be covered with a light-shielding reflective film.

Claims25

Dependent claims

A semiconductor light emitting device configured to emit light along an optical axis, the semiconductor light emitting device comprising:

a first side surface extending substantially parallel with the optical axis;
a second side surface extending substantially parallel with the optical axis;
an insulating support;
a pair of electrodes formed on the insulating support;
a housing including a groove having a bottom, the housing disposed adjacent the insulating support and exposing a portion of the pair of electrodes at the bottom of the groove;
a semiconductor light emitting element disposed adjacent the bottom of the groove and connected to the exposed portion of the pair of electrodes;
a sealing resin filled in the groove of the housing and including a light emission side through which light from the semiconductor light emitting element passes;
each of the insulating support, the pair of electrodes, the housing, and the sealing resin including a first end face and a second end face, wherein each of the first end faces are substantially flush with one another and define the first side surface and each of the second end faces are substantially flush with one another and define the second side surface;
the first end face of the sealing resin having a width extending in a direction perpendicular to the optical axis and including,
a first edge extending along the light emission side, and
a second edge opposed to the first edge and spaced from the light emission side in a direction along the optical axis, and
the second end face of the sealing resin having a width extending in a direction perpendicular to the optical axis and including,
a third edge extending along the light emission side, and
a fourth edge opposed to the third edge and spaced from the light emission side in a direction along the optical axis;
and
a first light-shielding reflective member on the first side surface, extending in a direction of the optical axis from a position adjacent the first edge of the sealing resin to at least a position adjacent the second edge of the sealing resin, and extending in a direction perpendicular to the optical axis by a distance substantially equal to the width of the first end face of the sealing resin;
and
a second light-shielding reflective member on the second side surface, extending in a direction of the optical axis from a position adjacent the third edge of the sealing resin, beyond the fourth edge of the sealing resin, to a position that lies on the second end face of the insulating support, and the second light-shielding reflective member extending a distance substantially equal to the width of the second end face of the sealing resin.

15 more elements

A method for fabricating a semiconductor light emitting device, comprising:

providing a multi-piece semiconductor light emitting device body including an insulating support, a pair of electrodes formed on the insulating support, a housing including a groove having a bottom, the housing disposed adjacent the insulating support and exposing a portion of the pair of electrodes at the bottom of the groove, a plurality of semiconductor light emitting elements disposed adjacent the bottom of the groove at predetermined intervals and connected to the exposed portion of the pair of electrodes, and a sealing resin filled in the groove of the housing and entirely sealing the plurality of semiconductor light emitting elements, wherein the sealing resin includes a light emission surface through which light from the plurality of semiconductor light emitting elements passes;
cutting the multi-piece semiconductor light emitting device body in predetermined intervals to produce an individual semiconductor light emitting device body having an optical axis and a pair of opposed cut end faces, wherein a first one of the pair of cut end faces includes a first exposed face of the sealing resin having a width extending in a direction perpendicular to the optical axis, and wherein a second one of the pair of cut end faces includes a second exposed face of the insulating support and a second exposed face of the sealing resin, the second exposed face including a second edge abutting the light emission surface, and the second exposed face of the sealing resin having a width extending in a direction perpendicular to the optical axis;
covering the first one of the pair of cut end faces with a first light-shielding reflective member such that first light-shielding reflective member entirely covers the first exposed face of the sealing resin;
and
covering a second area on the second one of the pair of cut end faces with a second light-shielding reflective member, wherein the second area extends in a direction of the optical axis from a position adjacent the second edge of the sealing resin to at least a position in a middle of the exposed face of the insulating support, and the second area having a width extending in a direction perpendicular to the optical axis that is substantially equal to the width of the second exposed face of the sealing resin.

2 more elements

A method for fabricating a semiconductor light emitting device comprising:

providing a multi-piece semiconductor light emitting device body including an insulating support, a pair of electrodes formed on the insulating support, a housing including a groove having a bottom, the housing disposed adjacent the insulating support and exposing a portion of the pair of electrodes at the bottom of the groove, a plurality of semiconductor light emitting elements disposed adjacent the bottom of the groove at predetermined intervals and connected to the exposed portion of the pair of electrodes, and a sealing resin filled in the groove of the housing and entirely sealing the plurality of semiconductor light emitting elements, wherein the sealing resin includes a light emission surface through which light from the plurality of semiconductor light emitting elements passes;
cutting the multi-piece semiconductor light emitting device body in predetermined intervals to produce an individual semiconductor light emitting device body having an optical axis and a pair of opposed cut end faces, wherein a first one of the pair of cut end faces includes a first exposed face of the sealing resin, the first exposed face of the sealing resin including a first edge abutting the light emission surface and an opposite edge adjacent a respective one of the plurality of semiconductor light emitting elements, and wherein a second one of the pair of cut end faces includes,
a second exposed face of the insulating support, and
a second exposed face of the sealing resin having a width extending in a direction perpendicular to the optical axis and including a second edge abutting the light emission surface;
covering a first area on the first one of the pair of cut end faces with a first light-shielding reflective member, wherein the first area extends from a position spaced inwardly in a direction of the optical axis from the first edge of the sealing resin to a position adjacent the opposite edge of the sealing resin;
and
covering a second area of the second one of the pair of cut end faces with a second light-shielding reflective member, wherein the second area extends from a position spaced inwardly in a direction of the optical axis from the second edge of the sealing resin to at least a position adjacent a middle of the second exposed face of the insulating support, and the second area having a width extending in a direction perpendicular to the optical axis that is substantially equal to the width of the second exposed face of the sealing resin.

4 more elements

A method for fabricating a semiconductor light emitting device, comprising:

providing a multi-piece semiconductor light emitting device body including an insulating support, a pair of electrodes formed on the insulating support, a housing including a groove having a bottom, the housing disposed adjacent the insulating support and exposing a portion of the pair of electrodes at the bottom of the groove, a plurality of semiconductor light emitting elements disposed adjacent the bottom of the groove at predetermined intervals and connected to the exposed portion of the pair of electrodes, and a sealing resin filled in the groove of the housing and entirely sealing the plurality of semiconductor light emitting elements, wherein the sealing resin includes a light emission surface through which light from the plurality of semiconductor light emitting elements passes;
cutting the multi-piece semiconductor light emitting device body in predetermined intervals to produce an individual semiconductor light emitting device body having an optical axis and a pair of opposed cut end faces, wherein a first one of the pair of cut end faces includes a first exposed face of the sealing resin, and wherein a second one of the pair of cut end faces includes,
a second exposed face of an insulating support,
a second exposed face of the sealing resin, the second exposed face of the sealing resin having a width extending in a direction perpendicular to the optical axis, and the second exposed face of the sealing resin includes a second edge abutting the light emission surface, and
a second exposed face of the exposed portion of the pair of electrodes;
covering the first exposed face of the sealing resin in its entirety with a first light-shielding reflective member;
covering a second area on the second one of the pair of cut end faces with a second light-shielding reflective member, wherein the second area extends in a direction of the optical axis from a position adjacent the second edge of the sealing resin to at least a portion of the second exposed face of the exposed portion of the pair of electrodes, wherein the second area has a width in a direction perpendicular to the optical axis along the exposed face of the exposed portion of the pair of electrodes substantially equal to the width of second the exposed face of the sealing resin;
and
covering a portion of the exposed face of the insulating support with a third light-shielding reflective member.

6 more elements

Dependencies are inferred from the claim text.