Method for producing an led chip and led chip
AssigneeOSRAM Opto Semiconductors GmbH
InventorsHerbert Brunner, Dieter Eissler, Helmut Fischer, Ewald Karl Michael Guenther, Alexander Heindl
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AssigneeOSRAM Opto Semiconductors GmbH
InventorsHerbert Brunner, Dieter Eissler, Helmut Fischer, Ewald Karl Michael Guenther, Alexander Heindl
Estimating the term…
A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
A method for producing at least one chip provided with a luminescence conversion material comprising at least one phosphor, comprising the steps of:
A method for producing at least one chip provided with a luminescence conversion material comprising at least one phosphor, comprising the steps of:
An chip comprising a base body, which chip is suitable for emitting electromagnetic radiation and is provided on at least one main surface with a luminescence conversion material comprising at least one phosphor,
An LED chip comprising a base body, which chip is suitable for emitting electromagnetic radiation and is provided on at least one main surface with a luminescence conversion material comprising at least one phosphor,
Dependencies are inferred from the claim text.