Led chip package structure with multifunctional integrated chips and a method for making the same
AssigneeHarvatek Corporation
InventorsBily Wang, Shih-Yu Wu, Wen-Kuei Wu
Life of this patent
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Abstract
An LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.
Claims36
An LED chip package structure with multifunctional integrated chips, comprising:
- a substrate unit;
- a light-emitting unit having a plurality of LED chips electrically arranged on the substrate unit;
- a chip unit electrically arranged on the substrate unit, wherein the chip unit is arranged between the light-emitting unit and a power source;
- and
- a package colloid unit covering the LED chips.
A method for making an LED chip package structure with multifunctional integrated chips, comprising:
- providing a substrate unit;
- electrically arranging a light-emitting unit on the substrate unit, wherein the light-emitting unit has a plurality of LED chips;
- electrically arranging a chip unit on the substrate unit, wherein the chip unit is arranged between the light-emitting unit and a power source;
- and
- covering the LED chips with a package colloid unit.
Dependencies are inferred from the claim text.