Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
AssigneeHoneywell International Inc.
InventorsIan Bentley, Alistair D. Bradley
Life of this patent
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Abstract
A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC die are in same order. The pressure sense die and the compensation IC can be connected directly with wire bonds in order to reduce the number of wire bonds and to improve reliability. The pressure sense die can be designed with multiple wire bond pad patterns in order to be utilized with different programmable compensation IC dies.
Claims20
A method for direct die-to-die wire bonding, comprising;
- mounting a pressure sense die to a ceramic substrate, wherein said pressure sense die comprises at least one wire bond pad pattern associated with a plurality of wire bond pads and a programmable compensation IC die that includes a plurality of bonding leads;
- positioning said pressure sense die and said programmable compensation IC die beside each other, such that said plurality of wire bond pads associated with said pressure sense die and said plurality of bonding leads of said programmable compensation IC die are arranged in a same order;
- and
- electrically connecting said plurality of wire bond pads to corresponding said plurality of bonding leads associated with said programmable compensation IC die directly with at least one wire bond, thereby reducing a total number of said at least one wire bond and improving reliability thereto.
An apparatus for direct die-to-die wire bonding, comprising;
- a pressure sense die mounted to a ceramic substrate, said pressure sense die comprising at least one wire bond pad pattern associated with a plurality of wire bond pads and a programmable compensation IC die that includes a plurality of bonding leads;
- wherein said pressure sense die and said programmable compensation IC die positioned beside each other, such that said plurality of wire bond pads associated with said pressure sense die and said plurality of bonding leads of said programmable compensation IC die are arranged in a same order;
- and
- wherein said plurality of wire bond pads are electrically connected and correspond to said plurality of bonding leads associated with said programmable compensation IC die directly with at least one wire bond, thereby reducing a total number of said at least one wire bond and improving reliability thereto.
An apparatus for direct die-to-die wire bonding, comprising;
- a pressure sense die mounted to a ceramic substrate, said pressure sense die comprising at least one wire bond pad pattern associated with a plurality of wire bond pads and a programmable compensation IC die that includes a plurality of bonding leads;
- wherein said pressure sense die and said programmable compensation IC die positioned beside each other, such that said plurality of wire bond pads associated with said pressure sense die and said plurality of bonding leads of said programmable compensation IC die are arranged in a same order;
- wherein said plurality of wire bond pads are electrically connected and correspond to said plurality of bonding leads associated with said programmable compensation IC die directly with at least one wire bond, thereby reducing a total number of said at least one wire bond and improving reliability thereto;
- and
- wherein said pressure sense die is configured with said at least one wire bond pad pattern, such that said pressure sense die is compatible with a plurality of compensation IC dies.
Dependencies are inferred from the claim text.