Single-sided high throughput wet etching and wet processing apparatus and method

A processing system, comprising:

• a plurality of chucks, each of the chucks configured to support a substrate such that a bottom surface of the substrate is exposed;
• a conveyor configured to guide the plurality of chucks along a continuous path;
• and
• a processing arrangement configured to process the bottom surface of each substrate when the track guides the respective chuck over the processing arrangement, the processing arrangement including a fluid meniscus arranged to contact the bottom surface of each substrate when the conveyor guides the chucks over the processing arrangement.

A method of processing substrates, comprising:

• mounting a substrate to a chuck;
• moving the chuck along a track that forms a continuous path;
• and
• passing the substrate over a processing arrangement such that the processing arrangement causes exposed bottom surface of the substrate to contact a fluid meniscus of the processing arrangement.