Pga type wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsAkio Horiuchi, Yoshikazu Hirabayashi, Yoshitaka Matsushita, Kazuhiro Oshima
Life of this patent
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Abstract
A PGA type wiring board includes a wiring board to which a head portion of a pin is joined to a pad portion with solder interposed therebetween, and a pin fixing plate having a through hole formed therein through which a shank portion of the pin is inserted, and having an adhesive layer formed on one surface thereof. The pin fixing plate is bonded to the wiring board with the adhesive layer interposed therebetween while the shank portion of the pin is inserted through the through hole. The through hole is shaped in a stepped form with a two-step configuration when viewed in cross section.
Claims8
A PGA type wiring board comprising:
- a wiring board having a pad portion to which a head portion of a pin is joined with a conductive material interposed therebetween;
- and
- a pin fixing plate having a through hole formed therein through which a shank portion of the pin is inserted, and having an adhesive layer formed on one surface thereof, wherein
- the pin fixing plate is bonded to the wiring board with the adhesive layer interposed therebetween while the shank portion of the pin is inserted through the through hole.
A method of manufacturing a PGA type wiring board, comprising:
- preparing a wiring board having pad portions to which respective head portions of pins are joined with a conductive material interposed therebetween;
- fabricating a pin fixing plate having through holes formed therein for inserting respective shank portions of the pins therethrough, the through holes being formed at a plurality of positions matching an arrangement of the pins;
- forming an adhesive layer in an uncured state on one surface of the pin fixing plate;
- and
- bonding the pin fixing plate to the wiring board, the bonding involving:
- disposing the wiring board and the pin fixing plate in such a manner that a surface of the wiring board on which the pins are joined faces the one surface of the pin fixing plate on which the adhesive layer is formed;
- bringing the facing surfaces into contact with each other while inserting the respective shank portions of the pins through the respective through holes;
- and
- curing the adhesive layer.
Dependencies are inferred from the claim text.