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US 2009/0211796 A1Published application
Electronic device substrate and its fabrication method, and electronic device and its fabrication method
AssigneesHitachi Cable, Ltd., NEC Electronics Corporation
InventorsAkira Chinda, Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida, Mamoru Mita
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Abstract
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
Claims2
An electronic device substrate, comprising:
- a thin-plate core substrate;
- a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon;
- an electrical insulation layer provided to surround the metal electrode;
- and
- wherein the core substrate is laminated with a support substrate.
2 more elements
Dependencies are inferred from the claim text.