Wiring board and manufacturing method therefor
AssigneeNEC Electronics Corporation
InventorKouji Nakaie
Life of this patent
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Abstract
In order to provide a wiring board having a structure different from a conventional structure and a manufacturing method therefor, a wiring board (1) includes: a first principal surface (6a); a second principal surface (6b) being opposed to the first principal surface (6a); a plurality of wiring layers (81, 82, 83, and 84); and a through hole (30) piercing at least one set of neighboring wiring layers among the plurality of wiring layers in a lamination direction of the at least one set of neighboring wiring layers. The through hole (30) includes a flat surface (21) that has conductivity and is decoupled electrically into at least two blocks formed on its surface at least partially.
Claims13
A wiring board, comprising:
- a first principal surface;
- a second principal surface being opposed to the first principal surface;
- a plurality of wiring layers;
- and
- a through hole piercing at least one set of neighboring wiring layers among the plurality of wiring layers in a lamination direction of the at least one set of neighboring wiring layers,
- wherein the through hole comprises a flat surface that has conductivity and is decoupled electrically into at least two blocks formed on its surface at least partially.
A method of manufacturing a wiring board, comprising:
- forming a hole having a flat surface in at least a part of the wiring board;
- forming a through hole by forming a conductive film on at least a part of the flat surface;
- and
- decoupling the flat surface electrically into at least two blocks.
Dependencies are inferred from the claim text.