Substrate module, method for manufacturing substrate module, and electronic device

A method for manufacturing a substrate module including an electronic component, the method comprising:

• a step (a) of providing a connection electrode connected to the electronic component on a first surface of a substrate;
• a step (b) of forming a first penetrating hole portion running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode;
• a step (c) of providing a penetrating electrode inside the first penetrating hole portion so that the penetrating electrode extends from inside the first penetrating hole portion to a second surface of the substrate;
• and
• a step (d) of providing a wiring electrode on the second surface of the substrate, and connecting together the wiring electrode and the penetrating electrode on the second surface of the substrate,
• wherein in the step (c), the penetrating electrode is provided so that a thickness of the penetrating electrode on the reverse surface of the connection electrode is greater than that on a side surface of the first penetrating hole portion, with the penetrating electrode defining a depression in a position opposing the reverse surface of the connection electrode.