Flexible Printed Circuit Assembly With Reduced Dielectric Loss
AssigneeInternational Business Machines Corporation
InventorsPaul V. Abrahamson, John Richard Dangler, Daniel Lee Dawiedezyk, Matthew Stephen Doyle
Life of this patent
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Abstract
A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.
Claims25
A flexible printed circuit assembly, comprising:
- a ground layer;
- a dielectric layer disposed on the ground layer;
- a signal trace disposed on the dielectric layer;
- an adhesive layer disposed on the dielectric layer and adjacent to the signal trace, the adhesive layer having a thickness smaller than a height of the signal trace, so that only a portion of a side surface of the signal trace is covered;
- and
- a fluorocarbon layer disposed on and bonded to the adhesive layer, and covering a remaining portion of the side surface of the signal trace.
A flexible printed circuit assembly, comprising:
- a ground layer;
- a first dielectric layer of first material disposed on the ground layer;
- a signal trace disposed on the dielectric layer;
- an adhesive layer disposed on the dielectric layer and adjacent to the signal trace, the adhesive layer having a thickness smaller than a height of the signal trace, so that only a portion of a side surface of the signal trace is covered;
- and
- a second dielectric layer of second material disposed on and bonded to the adhesive layer and covering a remaining portion of the side surface of the signal trace, a dielectric loss tangent of the second dielectric layer being smaller than a dielectric loss tangent of the first dielectric layer.
An improved flexible printed circuit assembly, the assembly having a ground layer, a first dielectric layer, a second dielectric layer, an adhesive layer disposed between the first and second dielectric layers, and a signal trace disposed on the first dielectric layer, wherein the improvement comprising:
- the second dielectric layer is comprised of fluorocarbon film;
- and
- the adhesive layer has a thickness smaller than a height of the signal trace, such that the adhesive surrounds a partial portion of a side surface of the signal trace, and the second dielectric layer surrounds a remaining portion of the side surface of the signal trace and covers a top surface of the signal trace.
A method of manufacturing a flexible printed circuit assembly, comprising:
- providing a ground layer;
- providing a dielectric layer on the ground layer;
- providing a signal trace on the dielectric layer;
- providing an adhesive layer on the dielectric layer and adjacent to the signal trace, the adhesive layer having a thickness smaller than a height of the signal trace, so that only a portion of a side surface of the signal trace is covered;
- and
- providing a fluorocarbon layer disposed on and bonded to the adhesive layer, which covers a remaining portion of the side surface of the signal trace.
Dependencies are inferred from the claim text.