Connecting structure and connecting method, liquid ejection head and method of manufacturing same

A method of connecting electronic components and a flexible circuit board having a pattern of wires, the method comprising the steps of:

• forming holes passing through the flexible circuit board in a thickness direction of the wires at parts of the wires to which the electronic components are connected;
• forming a weakened part arranged on a bending line in a bending part of the flexible circuit board on which the flexible circuit board bends when the wires are connected with the electronic components;
• forming projections on parts of the electronic components to which the wires are connected;
• and
• connecting the electronic components and the flexible circuit board by inserting the projections into the holes to electrically connect the wires with the electronic components and bending the flexible circuit board on the weakened part.

A liquid droplet ejection head, comprising:

• a connecting structure including:
• a flexible circuit board having a pattern of wires, holes passing through the flexible circuit board in a thickness direction of the wires at parts of the wires to which the electronic components are connected, and a weakened part arranged on a bending line in a bending part of the flexible circuit board on which the flexible circuit board bends when the wires are connected with a plurality of electronic components:
• wherein said electronic components respectively have projections on parts to which the wires are connected;
• and
• wherein the wires are electrically connected with said electronic components in a state where the projections are inserted in the holes and the flexible circuit board and are arranged on the bending line.

A method of manufacturing a liquid droplet ejection head, comprising:

• forming holes passing through a flexible circuit board in a thickness direction of a plurality of wires at parts of the wires to which a plurality of electronic components are connected;
• forming a weakened part arranged on a bending line in a bending part of the flexible circuit board on which the flexible circuit board bends when the wires are connected with the electronic components;
• forming projections on parts of the electronic components to which the wires are connected;
• and
• connecting the electronic components and the flexible circuit board by inserting the projections into the holes to electrically connect the wires with the electronic components and bending the flexible circuit board on the weakened part.