Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board
AssigneeApple Inc.
InventorsKyle Yeates, Teodor Dabov, Stephen Brian Lynch
Life of this patent
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Abstract
Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.
Claims18
A method for performing anisotropic conductive film (ACF) bonding, the method comprising:
- providing a printed circuit board, the printed circuit board having an electromagnetic interference (EMI) shielding can mounted thereon, the EMI shielding can including at least one wall, wherein the PCB includes at least one support arrangement located proximate to the wall;
- providing a flex circuit;
- locating an ACF between the PCB and the flex circuit, wherein the PCB, the flex circuit, and the ACF form a layer stack;
- applying a load to the at least one support arrangement, wherein applying the load to the at least one support arrangement causes the load to be applied on a first surface of the layer stack;
- and
- applying heat to a second surface of the layer stack, wherein the pressure and the heat are applied by a plurality of ACF support heads.
A method for performing anisotropic conductive film (ACF) bonding, the method comprising:
- providing a printed circuit board, the printed circuit board having an electromagnetic interference (EMI) shielding can arrangement mounted thereon, the EMI shielding can arrangement including a support structure;
- providing a flex circuit;
- locating an ACF between the PCB and the flex circuit, wherein the PCB, the flex circuit, and the ACF form a layer stack;
- applying a load to the support structure, wherein applying the load to the support structure causes the load to be applied on a first surface of the layer stack;
- and
- applying heat to a second surface of the layer stack, wherein the pressure and the heat are applied by a plurality of ACF support heads.
An apparatus comprising:
- a printed circuit board (PCB);
- a flex circuit;
- an electromagnetic interference (EMI) shielding can, the EMI shielding can being mounted on the PCB, wherein the EMI shielding can includes at least one wall;
- and
- a shielding support, the shielding support being in contact with the PCB and located proximate to the at least one wall, wherein the shielding support is arranged to support a load applied by an anisotropic conductive film (ACF) support head during an ACF process, the shielding support further being arranged to transfer the load such that an ACF bond may be formed between the PCB and the flex circuit.
An apparatus comprising:
- a printed circuit board (PCB);
- a flex circuit;
- and
- an electromagnetic interference (EMI) shielding can arrangement, the EMI shielding can arrangement being mounted on the PCB, wherein the EMI shielding can arrangement includes at least one support structure, the support structure being arranged to support a load applied by an anisotropic conductive film (ACF) support head during an ACF process, the support structure further being arranged to transfer the load such that an ACF bond may be formed between the PCB and the flex circuit.
Dependencies are inferred from the claim text.