Printed circuit board
AssigneeNitto Denko Corporation
InventorsKatsutoshi KAMEI, Voonyee HO
Life of this patent
Estimating the term…
Abstract
A first insulating layer is formed on a suspension body, and a write wiring trace and a read wiring trace are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring traces. A write wiring trace and a read wiring trace are formed on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring traces. The width of the wiring trace is larger than the width of the wiring trace, and the width of the wiring trace is larger than the width of the wiring trace.
Claims6
A printed circuit board comprising:
- a conductive substrate;
- a first insulating layer formed on said conductive substrate;
- a first wiring trace formed on said first insulating layer;
- a second insulating layer formed on said first insulating layer so as to cover said first wiring trace;
- a second wiring trace formed on said second insulating layer;
- and
- a third insulating layer formed on said second insulating layer so as to cover said second wiring trace, wherein
- said first and second wiring traces constitute a first signal line pair, and
- a width of said second wiring trace is larger than a width of said first wiring trace.
Dependencies are inferred from the claim text.