Back to results
US 2009/0211610 A1Published application
Method for treating a substrate
AssigneeSony Corporation
InventorsYasushi Honbe, Hitoshi Abe, Hayato Iwamoto
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a method for treating a substrate wherein a chemical is fed to a surface of the substrate, the method including the steps of: initially feeding a liquid whose electric conductivity is lower than the chemical to a surface of the substrate so as to wet at least a region where the chemical is to be discharged, and discharging the chemical to the region to treat the surface of the substrate with the discharged chemical.
Claims5
A method for treating a substrate wherein a chemical is fed to a surface of the substrate, the method comprising the steps of:
- initially feeding a liquid whose electric conductivity is lower than the chemical to a surface of said substrate so as to wet at least a region where said chemical is to be discharged, and
- discharging said chemical to said region to treat the surface of said substrate with the discharged chemical.
Dependencies are inferred from the claim text.