Load detection apparatus
AssigneeDenso Corporation
InventorHajime Nakagawa
Life of this patent
Estimating the term…
Abstract
An apparatus for detecting a load is disclosed. The apparatus includes a printed circuit board having a wiring pattern. The apparatus further includes a load sensing element located on the printed circuit board and including a pressure-sensitive member. The pressure-sensitive member has an electric property that is changeable according to the load. The apparatus further includes a load detection circuit arranged on the printed circuit board, connected with the load sensing element through the wiring pattern of the printed circuit board, and configured to detect a detection result of the load based on a change in the electric property of the load sensing element.
Claims15
An apparatus for detecting a load, comprising:
- a printed circuit board having a wiring pattern;
- a load sensing element located on the printed circuit board and including a pressure-sensitive member, the pressure-sensitive member having an electric property that is changeable according to the load applied to the pressure-sensitive member;
- and
- a load detection circuit arranged on the printed circuit board, connected with the load sensing element through the wiring pattern of the printed circuit board, and configured to detect the load based on a change in the electric property of the load sensing element.
An apparatus for detecting a load, comprising:
- a ceramic printed circuit board having first and second surface opposite to each other, the ceramic printed circuit board including:
- first and second resistor layers each located on the first surface of the ceramic printed circuit board and each having a resistance that is changeable according to the load applied thereto and temperature thereof;
- and
- a third resistor layer located on the first surface of the ceramic printed circuit board and having a resistance that is changeable according to temperature thereof;
- first and second pressure receivers respectively coupled with the first and second pressure-sensitive resistor layers, the first and second pressure receivers being configured to receive the load from outside and apply the received load to the first and second pressure-sensitive resistor layers, respectively;
- and
- a load detection IC mounted onto the first surface of the ceramic printed circuit board so that first and second pressure-sensitive resistor layers are arranged in a symmetric manner about the load detection IC,
- the load detection IC being electrically connected with the first and second pressure-sensitive resistor layers and the temperature compensating resistor layer,
- the load detection IC being configured to detect the load based on a change in resistance of the first and second pressure-sensitive resistor layers while compensating the change in resistance of the first and second pressure-sensitive resistor layers based on a change in resistance of the temperature compensating resistor layer.
Dependencies are inferred from the claim text.