Multisensor assembly
AssigneeKoninklijke Philips Electronics N.V.
InventorsPadraig O'Mahony, Frank Caris, Theo Kersjes, Christian Paquet
Life of this patent
Estimating the term…
Abstract
One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.
Claims28
A method, comprising:
- making a first sensor carried with a first wafer member and a second sensor carried with a second wafer member;
- forming an electromechanical sensor from a third wafer member, the third wafer member having a first side opposite a second side, and the electromechanical sensor including a sensor member extending into a cavity;
- and
- enclosing the sensor member by joining the first wafer member to the first side of the third wafer member and the second wafer member to the second side (54b) of the third wafer member to provide a multisensor assembly.
A method, comprising:
- providing a first sensor from a first layer of material and a second sensor from a second layer of material, the first sensor detecting a different characteristic than the second sensor;
- forming an electromechanical motion detector from a third layer of material;
- and
- attaching the third layer to the first layer and the second layer, the third layer being positioned between the first layer and the second layer after said attaching to at least partially enclose the electromechanical motion detector and provide a multisensor assembly.
An apparatus, comprising:
- a multisensor assembly including:
- an electromechanical sensor member formed in a cavity defined with one wafer layer;
- a first other sensor carried with a first one of at least two or more other wafer layers;
- a second other sensor carried with a second one of the other wafer layers;
- and
- wherein the one wafer layer is positioned between the first one of the other wafer layers and the second one of the other wafer layers, the electromechanical sensor member being enclosed between the first one of the other wafer layers and the second one of the other wafer layers.
A multisensor assembly, comprising:
- means for sensing a first characteristic carried with a first wafer layer;
- means for sensing a second characteristic carried with a second wafer layer;
- a microelectronmechanical system (MEMS) device including a sensor member;
- and
- means for sealing the sensor member between the first wafer layer and the second wafer layer.
A method, comprising:
- providing a first sensor from a first wafer member and a second sensor from a second wafer member, the first sensor sensing a different characteristic than the second sensor;
- forming an electromechanical motion sensor including one or more sensor members in a cavity;
- and
- sealing at least the one or more members in the cavity between the first wafer member and the second wafer member Act to provide the multisensor assembly.
Dependencies are inferred from the claim text.