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US 2009/0200548 A1Published application
Guard ring extension to prevent realiability failures
AssigneeIntel Corporation
InventorsNicole Meier Chang, George J. Korsh, Shafqat Ahmed, John Nugent, Ed Nabighian
Life of this patent
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Abstract
An embodiment of the present invention is a technique to prevent reliability failures in semiconductor devices. A trench is patterned in a polyimide layer over a guard ring having a top metal layer. A passivation layer is etched at bottom of the trench. A capping layer is deposited on the trench over the etched passivation layer. The capping layer and the top metal layer form a mechanical strong interface to prevent a crack propagation.
Claims16
A method comprising:
- patterning a first passivation layer over an area including a guard ring;
- depositing a metal layer on the patterned passivation layer on top of the guard ring;
- etching the metal layer to form a cap on top of the guard ring, depositing a second passivation layer on the cap;
- and
- depositing a polyimide layer on the second passivation layer.
2 more elements
A method comprising:
- patterning a polyimide layer and a passivation layer over a top metal layer piece, the polyimide layer and the passivation layer covering a guard ring including a top metal layer;
- and
- depositing a capping layer on the patterned polyimide and passivation layers, the capping layer and the top metal layer piece forming a mechanical strong interface to hinder a crack initiation near the top metal layer piece.
A method comprising:
- patterning a passivation layer on top of a guard ring;
- and
- depositing a first polyimide layer on the passivation layer to cover the passivation layer such that an edge of the passivation layer is not exposed.
A device comprising:
- a first passivation layer patterned over an area including a guard ring;
- a metal layer deposited and etched on the patterned passivation layer on top of the guard ring, the metal layer forming a cap on top of the guard ring,
- a second passivation layer deposited on the cap;
- and
- a polyimide layer deposited on the second passivation layer.
2 more elements
A device comprising:
- a polyimide layer and a passivation layer under the polyimide layer patterned over a top metal layer piece, the polyimide and the passivation layers covering a guard ring including a top metal layer;
- and
- a capping layer deposited on the patterned polyimide and passivation layers, the capping layer and the top metal layer piece forming a mechanical strong interface to hinder a crack initiation near the top metal layer piece.
A device comprising:
- a passivation layer patterned on top of a guard ring;
- and
- a first polyimide layer deposited on the passivation layer to cover the passivation layer such that an edge of the passivation layer is not exposed.
Dependencies are inferred from the claim text.