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US 2009/0176104 A1Published application
Resin composition and application thereof
AssigneeIteq Corporation
InventorsLi-Chun CHEN, Jeng-I Chen, Bill Weng
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Abstract
A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
Claims17
A resin composition, comprising:
- a solvent;
- and
- a solid content dispersed in the solvent, the solid content does not contain phenolic resin, and the solid content comprises:
- a phosphorus-containing epoxy resin;
- and
- a benzoxazine resin, the weight ratio of the benzoxazine resin to the phosphorus-containing epoxy resin is about 0.6:1˜3.0:1.
3 more elements
Dependencies are inferred from the claim text.