Curable Resin Composition
AssigneeKaneka Corporation
InventorsJohan Indesteege, Guido Van Sande
Life of this patent
Estimating the term…
Abstract
It is an object of the present invention to provide a curable resin composition, having excellent workability (thixotropic properties and applicability) required in applications such as floor adhesives, without causing a decrease in mechanical properties, which contains an organic polymer having a reactive silicon group. The object is attained by a curable resin composition including: an organic polymer (A) having a reactive silicon group; a filler (B) obtained through a combination of three types of filler, namely a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm to less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.
Claims8
A curable resin composition comprising:
- an organic polymer (A) having at least one reactive silicon group per molecule;
- a filler (B) simultaneously containing a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm to less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.
Dependencies are inferred from the claim text.