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US 2009/0156753 A1Published application
Silphenylene compound and process for producing the same
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMichihiro Sugo, Takahiro Goi, Tomoyuki Goto, Shohei Tagami
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Abstract
The present invention relates to a silphenylene compound represented by the following formula (1): in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.
Claims6
A silphenylene compound represented by the following formula (1):
- wherein R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms.
Dependencies are inferred from the claim text.