Loading patent…
AssigneeLam Research Group
InventorsDavid S.L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
Estimating the term…
The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
A cleaning material applied on a surface of a patterned substrate for defining integrated circuit devices to remove contaminants from the surface, comprising:
A cleaning material applied to a surface of a patterned substrate for defining integrated circuit devices to remove contaminants from the surface, comprising:
A cleaning material applied on a surface of a patterned substrate for defining integrated circuit devices to remove contaminants from the surface, comprising:
A cleaning material applied on a surface of a patterned substrate for defining integrated circuit devices to remove contaminants from the surface, comprising:
Dependencies are inferred from the claim text.