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US 2009/0156008 A1Published application
Polishing Composition and Polishing Method Using The Same
AssigneeFujimi Incorporated
InventorKenji Sakamoto
Life of this patent
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Abstract
A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of semiconductor substrates in a suitable manner.
Claims10
A polishing composition comprising:
- an abrasive;
- at least one compound selected from the group consisting of azoles and derivatives thereof;
- and
- water.
1 more element
A method for polishing a surface of an object, the method comprising:
- preparing a polishing composition including an abrasive, at least one compound selected from the group consisting of azoles and derivatives thereof, and water;
- and
- polishing the surface of the object using the prepared polishing composition.
Dependencies are inferred from the claim text.