Integrated circuit package system with offset stacking and anti-flash structure
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua
Life of this patent
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Abstract
An integrated circuit package system includes: mounting a device structure in an offset location over a carrier with the device structure having a bond pad and a contact pad; connecting an electrical interconnect between the bond pad and the carrier; forming an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad; and forming a package encapsulation adjacent to the anti-flash structure and over the carrier.
Claims20
An integrated circuit package system comprising:
- mounting a device structure in an offset location over a carrier with the device structure having a bond pad and a contact pad;
- connecting an electrical interconnect between the bond pad and the carrier;
- forming an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad;
- and
- forming a package encapsulation adjacent to the anti-flash structure and over the carrier.
An integrated circuit package system comprising:
- mounting a device structure in an offset location over a carrier with the device structure having a bond pad and a contact pad;
- mounting an integrated circuit device over the carrier;
- mounting a passive device over the carrier;
- connecting an electrical interconnect between the bond pad and the carrier;
- forming an anti-flash structure on the device structure with the anti-flash structure exposing the contact pad;
- and
- forming a package encapsulation adjacent to the anti-flash structure and over the carrier.
An integrated circuit package system comprising:
- a carrier;
- a device structure in an offset location over the carrier with the device structure having a bond pad and a contact pad;
- an electrical interconnect between the bond pad and the carrier;
- an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad;
- and
- a package encapsulation adjacent to the anti-flash structure and over the carrier.
Dependencies are inferred from the claim text.