Robust die bonding process for led dies
OwnerBoris Kolodin, Xiang Gao +2inventors
InventorsBoris Kolodin, Xiang Gao, Ivan Eliashevich, Stanton E. Weaver, JR.
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Abstract
Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and/or sensitive components thereon endure during the bonding process.
Claims20
A die bonding system, comprising:
- a thermally conductive pickup tool that picks up a die;
- a heater that heats the pickup tool to a predetermined temperature, wherein the heated pickup tool heats a die attachment material that is employed to couple the die to a submount to a first temperature that is below the melting point of the die attachment material;
- and
- an ultrasonic transducer coupled to the pickup tool, wherein ultrasonic transducer heats the die attachment material to a second temperature that is equal to or greater than the melting point of the die attachment material.
A method of bonding a die to a submount, comprising:
- positioning a die over a submount using a vacuum tool;
- conductively or remotely applying heat to the vacuum tool and conductively heating a die attachment material on the die to a first predetermined temperature;
- applying ultrasonic energy to the die to further heat the die attachment material to a second predetermined temperature;
- and
- applying a bonding force to the die to bond the die to the submount.
An apparatus for bonding a die to a submount, comprising:
- means for positioning a die over a submount using a vacuum tool;
- means for applying heat to the vacuum tool and conductively heating a die attachment material on the die to a first predetermined temperature;
- means for applying ultrasonic energy to the die to further heat the die attachment material to a second predetermined temperature;
- and
- means for applying a bonding force to the die to bond the die to the submount.
Dependencies are inferred from the claim text.