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US 2009/0155956 A1Published application
Semiconductor device
AssigneeInfineon Technologies AG
InventorsJens Pohl, Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer
Life of this patent
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Abstract
A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate includes multiple semiconductor chips. An electrically conductive layer is applied to the first and second main surface of the encapsulation plate at the same time.
Claims25
A method, comprising:
- providing an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface, the encapsulation plate comprising multiple semiconductor chips;
- and
- applying an electrically conductive layer to the first and second main surface of the encapsulation plate at the same time.
A method, comprising:
- covering a first semiconductor chip with a molding compound;
- forming a through hole in the molding compound;
- and
- depositing a solder material in the through hole.
1 more element
A method, comprising:
- covering a semiconductor chip with a molding compound;
- forming a through hole in the molding compound;
- generating a first electrically conductive layer on a surface of the molding compound;
- and
- generating a second electrically conductive layer on a surface of the through hole.
2 more elements
Dependencies are inferred from the claim text.