Thermal mechanical flip chip die bonding
AssigneeSkyworks Solutions, Inc.
InventorSteve Xin Liang
Life of this patent
Estimating the term…
Abstract
A thermal mechanical process for bonding a flip chip die to a substrate. The flip chip die includes a plurality of copper pillar bumps, each copper pillar bump of the plurality of copper pillar bumps having a copper portion attached to the die and a bonding cap attached to the copper portion. The process includes positioning the die on the substrate such that the bonding cap of each copper pillar bump of the plurality of copper pillar bumps contacts a corresponding respective one of a plurality of bonding pads on the substrate, and thermosonically bonding the die to the substrate.
Claims19
A method of bonding a die comprising at least one copper pillar bump to a substrate having a corresponding at least one pad, the copper pillar bump including a copper portion and a bonding cap, the method comprising:
- positioning the die on the substrate such that the bonding cap of the at least one copper pillar bump contacts the at least one pad;
- and
- applying thermal and mechanical energy to the at least one copper pillar bump to bond the die to the substrate.
A method of manufacture of a semiconductor device, the method comprising:
- forming a plurality of copper pillar bumps on a wafer, each copper pillar bump of the plurality of copper pillar bumps comprising a copper portion and a bonding cap;
- singulating the wafer into a plurality of dies, each die comprising at least one copper pillar bump of the plurality of copper pillar bumps;
- positioning the plurality of dies on a substrate;
- and
- thermosonically bonding the plurality of dies to the substrate.
A method of bonding a flip chip die to a substrate, the flip chip die comprising a plurality of copper pillar bumps, each copper pillar bump of the plurality of copper pillar bumps comprising a copper portion attached to the die and a bonding cap attached to the copper portion, the method comprising:
- positioning the die on the substrate such that the bonding cap of each copper pillar bump of the plurality of copper pillar bumps contacts a corresponding respective one of a plurality of bonding pads on the substrate;
- and
- thermosonically bonding the die to the substrate.
Dependencies are inferred from the claim text.