Semiconductor device fabricating method and fabricating apparatus
AssigneeOki Semiconductor Co., Ltd.
InventorYoshihiro Saeki
Life of this patent
Estimating the term…
Abstract
Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.
Claims13
A method of fabricating a semiconductor device by mounting, on a substrate, a semiconductor chip that has obverse electrodes provided at an obverse side, and reverse electrodes provided at a reverse side so as to oppose the obverse electrodes and electrically connected to the obverse electrodes, the method comprising:
- (a) selecting a plurality of attraction regions, at which a holding member is made to attract, from among regions of the reverse side other than regions at which are provided reverse electrodes that are electrically connected to obverse electrodes of the semiconductor chip that are to be joined to electrodes of the substrate;
- (b) holding the semiconductor chip from the reverse side by causing the holding member to attract the plurality of attraction regions;
- and
- (c) joining obverse electrodes of the semiconductor chip and electrodes of the substrate by placing, on the substrate, the semiconductor chip that is held.
A method of fabricating a semiconductor device by forming a semiconductor chip that has obverse electrodes provided at an obverse side, and reverse electrodes provided at a reverse side so as to oppose the obverse electrodes and electrically connected to the obverse electrodes, and mounting the semiconductor chip on a substrate, the method comprising:
- (e) forming reverse electrodes, that are connected to obverse electrodes of the semiconductor chip that are to be joined to electrodes of the substrate, at regions of the reverse side other than a plurality of attraction regions, at which a holding member, that holds the semiconductor chip from the reverse side, is made to attract;
- (f) holding the semiconductor chip from the reverse side by causing the holding member to attract the plurality of attraction regions;
- and
- (g) joining the semiconductor chip and the substrate by moving the holding member and making positions of obverse electrodes of the semiconductor chip that is held and electrodes of the substrate coincide.
An apparatus for fabricating a semiconductor device by mounting, on a substrate, a semiconductor chip that has obverse electrodes provided at an obverse side, and reverse electrodes provided at a reverse side so as to oppose the obverse electrodes and electrically connected to the obverse electrodes, the apparatus comprising:
- a holding member at which a plurality of attracting openings are formed so as to attract a plurality of attraction regions, that exist at regions of the reverse side other than regions at which are provided reverse electrodes that are connected to obverse electrodes of the semiconductor chip that are to be joined to electrodes of the substrate, and hold the semiconductor chip from the reverse side;
- and
- a driving section driving the holding member so as to make positions of obverse electrodes of the semiconductor chip that is held and electrodes of the substrate coincide, and such that the semiconductor chip and the substrate are joined together.
Dependencies are inferred from the claim text.