Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

A microelectronic imager assembly comprising:

• a continuous dividing cover supported by a spacer;
• a continuous first substrate containing a plurality of image sensors;
• and
• a plurality of individual second substrates fixed on optical supports, wherein
• the optical supports are mounted on the continuous dividing cover,
• the number of second substrates corresponds to the number of image sensors, and
• the second substrates are aligned with a respective image sensor and a spacer chamber, the spacer chamber comprising;
• a top boundary including a portion of the continuous dividing cover;
• a bottom boundary of a portion of the continuous first substrate;
• and
• a lateral boundary of the spacer.

A microelectronic imager assembly comprising a plurality of microelectronic imagers, each microelectronic imager comprising:

• an imager die including a first substrate and image sensor, wherein the image sensor is at least partially within the first substrate;
• a spacer chamber centered on the imager die and enclosed by three distinct boundaries, a cover serving as the first boundary, the imager die serving as the second boundary, and an unbroken spacer residing between the first and second boundaries serving as the third boundary;
• and
• an optical device mounted on optical supports aligned with the imager die, wherein the optical supports are separated from the spacer chamber by the cover, the optical device comprises a second substrate and optics element, and wherein the optical supports comprise a bearing element for aligning the optical device with the imager die.

A microelectronic imager assembly, comprising:

• a plurality of spacer chambers, each spacer chamber comprising:
• a continuous spacer for sidewalls;
• an imager die as the spacer chamber lower boundary, the imager die further comprising;
• a first substrate,
• an imager sensor supported by the first substrate,
• integrated circuitry operatively coupled to the image sensor,
• an external contact assembly operatively coupled to the image sensor;
• and
• a cover as the spacer chamber upper boundary, wherein the cover has a bottom side and top side;
• and
• a plurality of optics support chambers, each optics support chamber comprising:
• a continuous optical support for sidewalls;
• the cover upper side as the optics support chamber lower boundary;
• and
• an optical device as the optics support chamber upper boundary, wherein each spacer chamber and optics support chamber is aligned with the image sensor.