Method for packaging led device
AssigneeEverlight Electronics Co., Ltd.
InventorWen-Chieh TSOU
Life of this patent
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Abstract
A method for packaging LED device comprises following steps: (1) A substrate with a cavity is provided; (2) A electrode layer is formed and located on the cavity and the surface of the substrate; (3) A opening through the cavity is formed, whereby a anode and a cathode are separated by the opening; (4) A LED chip is disposed on the bottom of the cavity and the opening, where the led chip is electrically connected to the anode and the cathode; (5) The cavity with the opening is filled with packaging material; (6) The packaging material is hardened, thereby the hardened packaging material with a recess that corresponding to the top of the chip; and (7) The LED device is formed by performing a cutting process along a cutting line in the cavity.
Claims8
A method for packaging LED device, comprising:
- providing a substrate having a cavity;
- forming an electrode layer on the cavity and a surface of the substrate;
- forming an opening on a bottom surface of the cavity, the opening divided the electrode layer into an anode area and a cathode area;
- disposing a LED die on the bottom surface of the cavity and being across the opening, and the LED die electrically connected to the anode and the cathode;
- filling an packaging material in the cavity and the opening;
- curing the packaging material, wherein the cured packaging material comprises a recess correspondingly formed above the LED die;
- and
- performing a cutting process along a cutting line in the cavity to form the LED device.
Dependencies are inferred from the claim text.