Heat-resistant adhesive sheet
OwnerHisayasu Kaneshiro, Takashi Kikuchi +1inventors
InventorsHisayasu Kaneshiro, Takashi Kikuchi, Takaaki Matsuwaki
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Abstract
It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.
Claims7
A heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.
A heat-resistant adhesive sheet to be continuously laminated onto metal foil by heat roller lamination at a temperature of not less than 350° C., the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.
Dependencies are inferred from the claim text.