Ultra-thin Polymeric Adhesion Layer
AssigneeMolecular Imprints, Inc.
InventorsFrank Y. Xu, Edward Brian Fletcher
Life of this patent
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Abstract
An imprint lithography imprinting stack includes a substrate and a polymeric adhesion layer adhered to the substrate. The polymeric adhesion layer includes polymeric components with an extended backbone length of at least about 2 nm. The backbones of the polymeric components may be substantially aligned in a planar configuration on the surface of the substrate, such that a thickness of the polymeric adhesion layer is less than about 2 nm.
Claims15
An imprint lithography imprinting stack comprising:
- a substrate;
- and
- a polymeric adhesion layer adhered to the substrate, wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
A method of forming an adhesion layer on an imprint lithography substrate, the method comprising:
- spin-coating a polymerizable composition onto an imprint lithography substrate;
- and
- solidifying the polymerizable composition to form a polymeric adhesion layer adhered to the imprint lithography substrate, wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
An imprint lithography method comprising:
- spin-coating a polymerizable composition on an imprint lithography substrate, wherein the polymerizable composition comprises polymeric components with an extended backbone length of at least about 2 nm;
- substantially aligning the backbones of the polymeric components in a planar configuration on the surface of the imprint lithography substrate;
- and
- solidifying the polymerizable composition to form a polymeric adhesion layer adhered to the imprint lithography substrate, wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
Dependencies are inferred from the claim text.