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US 2009/0155569 A1Published application
Heat-sensitive adhesive, and heat-sensitive adhesive material
AssigneeRicoh Company, Ltd.
InventorsTakehito Yamaguchi, Hitoshi Shimbo, Yutaka Kuga
Life of this patent
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Abstract
The present invention provides a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.
Claims12
A heat-sensitive adhesive comprising:
- a thermoplastic resin,
- a solid plasticizer, and
- an adhesion-imparting agent,
- wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.
1 more element
A heat-sensitive adhesive material comprising:
- a support, and
- a heat-sensitive adhesive layer provided on the support,
- wherein the heat-sensitive adhesive layer comprises a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, and
- wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.
1 more element
Dependencies are inferred from the claim text.