Ic chip package substrate having outermost glass fiber reinforced epoxy layers and related method
AssigneeInternational Business Machines Corporation
InventorsEdmund Blackshear, Kevin A. Dore
Life of this patent
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Abstract
An IC chip package having a glass reinforced outermost epoxy layers and related method are disclosed. In one embodiment, the IC chip package includes an IC chip; and a substrate coupled to the IC chip, the substrate including a glass fiber reinforced epoxy core, a plurality copper circuitry containing, particle reinforced epoxy layers symmetrically-oriented to each surface of the glass fiber reinforced epoxy core, and an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers, wherein the IC chip is coupled to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layer.
Claims9
A method comprising:
- forming a glass fiber reinforced epoxy core;
- forming a plurality of copper circuitry containing particle reinforced epoxy layers symmetrically to each surface of the glass fiber reinforced epoxy core;
- forming an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers;
- and
- mounting an IC chip to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layers.
An integrated circuit (IC) chip package comprising:
- an IC chip;
- and
- a substrate coupled to the IC chip, the substrate including a glass fiber reinforced epoxy core, a plurality copper circuitry containing, particle reinforced epoxy layers symmetrically-oriented to each surface of the glass fiber reinforced epoxy core, and an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers,
- wherein the IC chip is coupled to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layer.
Dependencies are inferred from the claim text.