Electronic device package and method of formation

An electronic device package, comprising:

• a sealed enclosure;
• an electronic device disposed in the sealed enclosure;
• and
• a conductive feedthrough allowing an electrical signal to pass into and/or out of the sealed enclosure;
• wherein the sealed enclosure comprises:
• a first substrate having a surface on which first and second conductor segments are disposed, and an electrically discontinuous region on the surface between the first and second conductor segments;
• and
• a spacer circumscribing the electronic device, the spacer comprising the conductive feedthrough, wherein the conductive feedthrough electrically connects the first and second conductor segments.

A prism-coupled optical assembly, comprising:

• a first substrate comprising a prism for coupling light into an integrated optical waveguide;
• an optical component on and/or in the first substrate;
• and
• a second substrate comprising an integrated optical waveguide optically coupled to the optical component and prism, wherein the first substrate is attached to the second substrate and an optical path extends through the first substrate.