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US 2009/0154513 A1Published application
Multilayer board and light-emitting module having the same
AssigneeLG Innotek Co., Ltd.
InventorKyung Ho SHIN
Life of this patent
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Abstract
Provided are a multilayer board and a light-emitting module having the same. The light-emitting module comprises a light-emitting diode chip and a multilayer board. The multilayer board is electrically connected to the light-emitting diode chip and comprises a nonconductive heat sink via and a thin copper layer.
Claims20
A light-emitting module comprising:
- a light-emitting diode chip;
- and
- a multilayer board connected electrically to the light-emitting diode chip and comprising a nonconductive heat sink via and a thin copper layer.
A light-emitting module comprising:
- a multilayer board comprising a first thin copper layer comprising a plurality of electrode patterns, and a nonconductive heat sink via;
- and
- a light-emitting diode chip connected electrically to the electrode patterns.
A multilayer board comprising:
- a first thin copper layer comprising a electrode pattern in a chip-mounting region;
- a second thin copper layer under the first thin copper layer;
- a resin between the first thin copper layer and the second thin copper layer;
- and
- a nonconductive heat sink via contacts at least one of the electrode pattern and the second thin copper layer.
2 more elements
Dependencies are inferred from the claim text.