Light Emitting Diode for Mounting to a Heat Sink

A light emitting diode (LED) apparatus for mounting to a heat sink, the LED apparatus comprising:

• a sub-mount;
• at least one LED die mounted on said sub-mount;
• and
• a thermally conductive slug having first and second areas, said first area being thermally coupled to said sub-mount;
• and
• a thermally conductive material disposed on said second area of said slug, said thermally conductive material having an outer surface having adhesive properties for securing the LED apparatus to the heat sink such that said second area is thermally coupled to the front surface of the heat sink.

A light emitting diode (LED) apparatus for mounting to a heat sink having a pair of spring clips attached to a front surface of the heat sink, each spring clip having a free end, the LED apparatus comprising:

• a sub-mount;
• at least one LED die mounted on said sub-mount;
• and
• a thermally conductive slug having first and second areas, said first area being thermally coupled to said sub-mount;
• and
• first and second slots located on opposite sides of an upper surface of the LED apparatus, said first and second slots being operable to receive respective free ends of the spring clips such that the second area of the slug is urged into thermal coupling with the heat sink when the LED apparatus is mounted on the heat sink.

A light emitting diode (LED) apparatus for mounting to a front surface of a heat sink, the heat sink having at least one opening formed therethrough, the LED apparatus comprising:

• a sub-mount having an upper surface and a lower surface;
• at least one LED die mounted on said upper surface of said sub-mount;
• a conductor strip bonded to said upper surface of said sub-mount adjacent said LED die and in electrical connection with said LED for supplying operating current thereto, said conductor strip having at least one connector portion that depends downwardly from said upper surface of said sub-mount;
• and
• an electrically insulating body molded around at least a portion of said connector portion and having an insertion snap proximate said connector portion, said insertion snap being operably configured to be received in the opening and to engage a back surface of the heat sink to secure the LED apparatus to the heat sink such that said lower surface of the sub-mount is thermally coupled to the front surface of the heat sink.

A light emitting diode (LED) apparatus for mounting to a heat sink, the LED apparatus comprising:

• a sub-mount;
• at least one LED die mounted on said sub-mount;
• and
• a metallic slug having first and second areas, said first area being thermally coupled to said sub-mount and said second area having a metallic stud protruding outwardly therefrom, said stud being operably configured to conduct a welding current from said slug to the heat sink to cause the LED apparatus to be welded to the heat sink such that said second area is thermally coupled to the heat sink.