Printed wiring board and method for manufacturing printed wiring board

A printed wiring board comprising:

• at least one wired base material having an electric conductive layer formed on one side of an insulating base material, and an adhesion layer formed on another side of the insulating base material;
• a plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the wired base material, penetrating the insulating base material and the adhesion layer, and fronting the other side of the insulating base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being buried in the adhesion layer, with the re-wiring portion connected to the plugging electrode,
• having a re-wiring layer configured with the wired base material and the re-wiring portion of the semiconductor device.

A printed wiring board comprising:

• at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material;
• a plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the wired base material, penetrating the insulating base material, and fronting another side of the insulating base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being buried in the insulating base material of the wired base material, with the re-wiring portion connected to the plugging electrode,
• having a supporting board disposed on an opposite side to the re-wiring portion of the semiconductor device, with an adhesion layer in between, and
• having a re-wiring layer configured with the wired base material and the re-wiring portion of the semiconductor device.

A printed wiring board comprising:

• at least one wired base material having an electric conductive layer formed on one side of an insulating base material, and an adhesion layer formed on another side of the insulating base material;
• a plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the wired base material, penetrating the insulating base material and the adhesion layer, and fronting the other side of the insulating base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being buried in the adhesion layer, with the re-wiring portion connected to the plugging electrode,
• having a supporting board disposed on an opposite side to the re-wiring portion of the semiconductor device, with an adhesion layer in between, and
• having a re-wiring layer configured with the wired base material and the re-wiring portion of the semiconductor device.

A printed wiring board comprising:

• at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material;
• a plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the wired base material, penetrating the insulating base material, and fronting another side of the insulating base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being buried in the insulating base material of the wired base material, with the re-wiring portion connected to the plugging electrode,
• having a supporting board disposed on an opposite side to the re-wiring portion of the semiconductor device, with an adhesion layer put in between, the adhesion layer containing at least in part a heat conductive material of a heat conductivity of 0.4 W/m·K or more, and
• having a re-wiring layer configured with the wired base material and the re-wiring portion of the semiconductor device.

A printed wiring board comprising:

• at least one wired base material having an electric conductive layer formed on one side of an insulating base material, and an adhesion layer formed on another side of the insulating base material;
• a plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the wired base material, penetrating the insulating base material and the adhesion layer, and fronting the other side of the insulating base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being buried in the adhesion layer, with the re-wiring portion connected to the plugging electrode,
• having a supporting board disposed on an opposite side to the re-wiring portion of the semiconductor device, with an adhesion layer put in between, the adhesion layer containing at least in part a heat conductive material of a heat conductivity of 0.4 W/m·K or more, and
• having a re-wiring layer configured with the wired base material and the re-wiring portion of the semiconductor device.

A printed wiring board comprising:

• at least one first wired base material configured with an insulating base material, and an electric conductive layer formed on one side of the insulating base material;
• a first plugging electrode made of an electric conductive paste, connected to the electric conductive layer of the first wired base material, penetrating the insulating base material, and fronting another side of the insulating base material;
• at least one second wired base material configured with an insulating base material, and an electric conductive layer formed on another side of this insulating base material;
• a second plugging electrode connected to the electric conductive layer of the second wired base material, penetrate the insulating base material of the second wired base material, and electrically connected to the electric conductive layer of the first wired base material;
• and
• a semiconductor device having a re-wiring portion connected to an electrode formed on a semiconductor substrate,
• the semiconductor device being interposed between the first wired base material and the second wired base material, having the re-wiring portion connected to the first plugging electrode, and
• having a re-wiring layer configured with the first wired base material and the re-wiring portion of the semiconductor device.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material made of a resin having a thermal plasticity or a thermo-set resin in a partially cured state and having an electric conductive layer formed on one side thereof, and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning, to the plugging electrode, a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor board, and provisionally joining the semiconductor device to an adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material having an electric conductive layer on one side thereof and an adhesion layer as another side thereof, and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning to the plugging electrode a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor board, and provisionally joining the semiconductor device to the adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material made of a resin having a thermal plasticity or a thermo-set resin in a partially cured state and having an electric conductive layer formed on one side thereof, and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning to the plugging electrode a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor board, disposing a supporting board formed with an adhesion layer on an opposite side to the re-wiring portion of the semiconductor device, with the adhesion layer brought into contact thereon, and provisionally joining the semiconductor device to an adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material having an electric conductive layer on one side thereof and an adhesion layer as another side thereof, and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning to the plugging electrode a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor substrate, disposing a supporting board formed with an adhesion layer on an opposite side to the re-wiring portion of the semiconductor device, with this adhesion layer brought into contact thereon, and provisionally joining the semiconductor device to the adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material made of a resin having a thermal plasticity or a thermo-set resin in a partially cured state and having an electric conductive layer formed on one side thereof, and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning to the plugging electrode a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor substrate, disposing a supporting board formed with an adhesion layer containing at least in part a heat conductive material of a heat conductivity of 0.4 W/m·K or more on an opposite side to the re-wiring portion of the semiconductor device, with the adhesion layer brought into contact thereon, and provisionally joining the semiconductor device to an adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in an insulating base material having an electric conductive layer on one side thereof and an adhesion layer as another side thereof, and filing the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning to the plugging electrode a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor substrate, disposing a supporting board formed with an adhesion layer containing at least in part a heat conductive material of a heat conductivity of 0.4 W/m·K or more on an opposite side to the re-wiring portion of the semiconductor device, with this adhesion layer brought into contact thereon, and provisionally joining the semiconductor device to the adhesion layer of the insulating base material by a thermo-compression bonding;
• and
• a step of performing an adhesive bonding between insulating base materials, an adhesive bonding of the insulating base material and the semiconductor device, and a hardening of the electric conductive paste to make the plugging electrode, by a hot pressing as a single step.

A method of manufacturing a printed wiring board, comprising:

• a set of steps of forming a via hole in a first insulating base material having an electric conductive layer on one side thereof and filling the via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a set of steps of positioning, to the plugging electrode, a re-wiring portion of a semiconductor device having the re-wiring portion connected to an electrode formed on a semiconductor substrate, and provisionally joining, by a thermo-compression bonding, the semiconductor device to the first insulating base material, with an interlayer binding material in between;
• a set of steps of forming a via hole in a second insulating base material having an electric conductive layer on another side thereof, and filling this via hole with an electric conductive paste in a printing manner to make a plugging electrode;
• a step of laminating the second insulating base material to the first insulating base material, with an interlayer binding material in between, having the semiconductor device interposed between the insulating base materials, bringing the plugging electrodes of the insulating base materials into contact with each other;
• and
• a step of performing an adhesive bonding by the interlayer binding materials, and a hardening of the electric conductive pastes to make the plugging electrodes, by a hot pressing as a single step.