US 2009/0154131 A1Published application

Conductive connecting pin and package substrate

AssigneeIbiden Co., Ltd.

InventorsNaohiro HIROSE, Hitoshi ITO, Yoshiyuki IWATA, Masanori KAWADE, Hajime YAZU

Life of this patent

Estimating the term…

Loading patent…

Abstract

A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Claims20

Dependent claims

A package substrate comprising:

an outermost inter layer resin insulating layer including a filler comprising an inorganic compound;
a pad structure formed on the outermost inter layer resin insulating layer;
a solder resist formed on the outermost inter layer resin insulating layer and the pad structure, the solder resist having an opening exposing a partially exposed portion of the pad structure;
a conductive connecting pin configured to establish an electrical connection with another substrate, the conductive connecting pin being secured to the partially exposed portion of the pad structure via a solder, the solder being disposed over at least one metal layer formed in the partially exposed portion of the pad structure;
and
a via hole formed through the outermost inter layer resin insulating layer and configured to electrically connect the pad structure to at least one conductive circuit formed below the outermost inter layer resin insulating layer, the via hole being positioned directly below the pad structure,
wherein the at least one metal layer is formed in the partially exposed portion of the pad structure after the opening is formed in the solder resist.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/359,663Filed 26 Jan 2009
Priority: JP 10-35703916 Dec 1998
Published: 18 Jun 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification22 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H05K 1/112
Pads for surface mounting, e.g. lay-out: directly combined with via connections
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 3/28
Secondary treatment of printed circuits: applying non-metallic protective coatings

Family

Application09/830,949Continuation · filed 6 Jul 2001
Application12/359,663Continuation
US 7,902,659 B2Related patent
US 8,035,214 B1Related patent
US 2009/0154131 A1This patent

From the US filing history. Foreign family members aren’t listed.