PCB Embedded Electronic Elements Structure And Method Thereof
OwnerTing-Hao Lin, Chien-Wei Changinventors
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Abstract
Structure of embedded electronic elements in a PCB (printed circuit board) and the method for embedding the structure include assembling the electronic elements (such as a capacitor, a resistor, a diode) on the PCB, and then laminating other circuit layers. A group of electrodes of the electronic elements are aligned to a group of junctions on the PCB, respectively; the electronic elements are assembled on the group of junctions on the PCB; and then a metal layer is laminated on the PCB using gel film (dielectric gel) in which the PCB includes already embedded electronic elements.
Claims6
A method for embedding a plurality of electronic elements in a printed circuit board (PCB), comprising:
- aligning a group of electrodes of the electronic elements to a group of junctions on the PCB, respectively;
- assembling the electronic elements on the PCB through the group of junctions;
- and
- laminating a metal layer on the PCB above the electronic elements and the group of junctions using a gel film, wherein the electronic elements are embedded in the gel film between the group of junctions and the metal layer.
A structure of embedded electronic elements in a printed circuit board (PCB), comprising:
- a group of junctions, disposed in the PCB;
- a plurality of electronic elements, comprising a group of electrodes aligned to the group of junctions on the PCB, the electronic elements being assembled on the PCB through the group of junctions;
- a gel film, laminated on the group of junctions and on the electronic elements for embedding the electronic elements and the group of junctions;
- and
- a trace layer, formed on the gel film above the electronic elements and the group of junctions;
- wherein the electronic elements are embedded in the gel film between the group of junctions and the trace layer.
Dependencies are inferred from the claim text.