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US 2009/0154112 A1Published application
Packaging structure of power module
AssigneeDelta Electronics, Inc.
InventorsHeng-Chia Fan, Zi-Ying Zhou
Life of this patent
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Abstract
A power module includes a substrate, a power converter and a plurality of bond pads. The substrate includes a top surface and a bottom surface. The power converter is disposed on the substrate and includes at lease one semiconductor chip package. The semiconductor chip package is disposed on the top surface of the substrate. The bond pads are disposed on the bottom surface of the substrate, wherein at least some of the bond pads are electrically connected to the power converter and the plurality of bond pads have substantially identical area.
Claims11
A power module comprising:
- a substrate including a top surface and a bottom surface;
- a power converter disposed on said substrate and including at lease one semiconductor chip package, said semiconductor chip package being disposed on said top surface of said substrate;
- and
- a plurality of bond pads disposed on said bottom surface of said substrate, wherein at least some of said bond pads are electrically connected to said power converter and said plurality of bond pads have substantially identical area.
1 more element
Dependencies are inferred from the claim text.