Cooling Device and Electronic Apparatus Using the Same

A cooling system for an electronic apparatus for cooling a semiconductor device on an electronic circuit substrate mounted on the electronic apparatus, wherein

• the electronic circuit substrate is detachably installed in a casing which forms the electronic apparatus,
• the cooling system is formed of a heat transfer member and a cooling member which are separately formed, each having a sealed structure which contains a refrigerant,
• the heat transfer member includes a first heat transfer portion thermally connected to the semiconductor device at one end, and a second heat transfer portion thermally connected to the cooling member at the other end, and is detachable with respect to the casing together with the electronic circuit substrate when the electronic circuit substrate is inserted into or detached from the casing of the electronic circuit substrate, and
• the second heat transfer portion of the heat transfer member is disposed inside or outside the casing of the electronic apparatus by mounting the electronic circuit substrate on the electronic apparatus.