Chip on film structure
AssigneeAu Optronics Corporation
InventorsKe-Chih Chang, Chih-Hsiang Yang, Sheng-Kai Hsu, Yi-Chih Huang, Ying-Chao Chen
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Abstract
The chip on film structure for a liquid crystal display is disclosed. The chip on film structure includes a film substrate, a driver chip disposed on the film substrate, a plurality of the input pad, and a plurality of output pads. The input pads and the output pads are disposed on two opposite sides of the driver chip, and are electrically connect to the driver chip respectively. Each input pad comprises an extending portion extending from the input pads to a first cutting edge respectively, and a width of the extending portion is thinner than a width of the input pad, and the extending portions are cut along the first cutting edge.
Claims14
A chip on film structure for a liquid crystal display, the chip on film structure comprising:
- a film substrate having a first cutting edge and a second cutting edge opposite to the first cutting edge;
- a driver chip disposed on the film substrate;
- a plurality of input pads disposed on the film substrate and electrically connecting to the driver chip, wherein each input pad comprises an extending portion extending from the input pads to the first cutting edge respectively, wherein a width of each extending portion is thinner than a width of each input pad, and the extending portions are cut along the first cutting edge;
- and
- a plurality of output pads disposed on the film substrate and electrically connecting to the driver chip, wherein the output pads are disposed between the driver chip and the second cutting edge, and the output pads are not in contact with the second cutting edge.
A chip on film structure for a liquid crystal display, the chip on film structure comprising:
- a tape;
- a film substrate disposed on the tape comprising a first cutting edge and a second cutting edge opposite to the first cutting edge;
- a driver chip disposed on the film substrate;
- a plurality of input pads disposed on the film substrate and electrically connecting to the driver chip, wherein each input pads comprises an extending portion extending from the input pads to the first cutting edge respectively, wherein a width of each extending portion is thinner than a width of each input pad, and the extending portions are cut along the first cutting edge;
- and
- a plurality of output pads disposed on the film substrate and electrically connecting to the driver chip, wherein there is a distance arranged between the output pads and the second cutting edge, and the output pads are not in contact with the second cutting edge.
Dependencies are inferred from the claim text.