Wiring substrate and display device including the same

A wiring substrate, comprising:

• a substrate having a plurality of wirings extending substantially in parallel with each other and each having a terminal portion;
• an integrated circuit chip having a plurality of bump electrodes arranged to correspond to the respective terminal portions so as to face the respective terminal portions;
• an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin having electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes;
• and
• an insulating member arranged to isolate a terminal portion from a wiring and a bump electrode that are adjacent to the terminal portion and to isolate a bump electrode facing the terminal portion from a bump electrode and a wiring that are adjacent to the bump electrode.

A display device, comprising:

• a wiring substrate including a substrate having a plurality of wirings extending substantially in parallel with each other and each having a terminal portion, an integrated circuit chip having a plurality of bump electrodes arranged to correspond to the respective terminal portions so as to face the respective terminal portions, an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin having electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes, and an insulating member arranged to isolate a terminal portion from a wiring and a bump electrode that are adjacent to the terminal portion and to isolate a bump electrode facing the terminal portion from a bump electrode and a wiring that are adjacent to the bump electrode;
• a first electrode located on the wiring substrate;
• a display medium layer located on the first electrode;
• and
• a second electrode located on the display medium layer.

A display device, comprising:

• a first wiring substrate including a substrate having a plurality of first wirings extending substantially in parallel with each other and each having a terminal portion, an integrated circuit chip having a plurality of bump electrodes arranged to correspond to the respective terminal portions so as to face the respective terminal portions, an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin having electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes, and an insulating member arranged to isolate a terminal portion from a first wiring and a bump electrode that are adjacent to the terminal portion and to isolate a bump electrode facing the terminal portion from a bump electrode and a first wiring that are adjacent to the bump electrode;
• a second wiring substrate having the first wiring substrate mounted thereon and including a plurality of second wirings respectively electrically connected to the plurality of first wirings and a first electrode electrically connected to the plurality of second wirings;
• a display medium layer located on the first electrode;
• and
• a second electrode located on the display medium layer.