Reflowable Camera Module With Integrated Flash
AssigneeOmniVision Technologies, Inc.
InventorsJari Hiltunen, Jess Jan Young Lee
Life of this patent
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Abstract
A reflowable camera module is implemented using a Chip Scale Package (CSP). An image sensor is formed on one portion of the carrier. A light emitting diode (LED) is formed on another portion of the carrier. The LED serves as an integrated camera flash. Additional optical isolation is provided within the camera module to prevent stray light generated by the LED from degrading image quality.
Claims24
A camera module, comprising:
- an image sensor in a first portion of the camera module to capture digital images;
- and
- a flash in a second portion of the camera module;
- the image sensor and the flash mounted to a common carrier with the camera module optically isolating the first portion of the camera module from the second portion of the camera module.
A camera module, comprising:
- a Chip Scale Package (CSP) carrier;
- an image sensor mounted to a first portion of the CSP carrier;
- a light emitting diode (LED) mounted to a second portion of the CSP carrier to serve as a camera flash;
- and
- an optical barrier within the camera module to prevent stray light generated by the LED in a flash mode from degrading image quality
A camera module, comprising:
- an image sensor;
- a light emitting diode (LED) to serve as a camera flash;
- the image sensor and the LED mounted to a common Chip Scale Package (CSP) carrier having separate electrical connections for the image sensor and the LED;
- a common glass capping layer covering the image sensor and the LED;
- and
- optical isolation within the glass capping layer to prevent stray light generated by the LED from degrading image quality;
- the CSP carrier serving as the base of a reflowable camera module.
A method of forming a camera module comprising:
- mounting an image sensor to a first portion of a Chip Scale Package (CSP) carrier;
- mounting a light Emitting Diode (LED) to a second portion of the Chip Scale Package carrier;
- and
- forming optical isolation within a glass capping layer to optically isolate the first portion from the second portion.
A method of manufacturing a consumer device having an image sensor and a flash, comprising:
- providing a reflowable camera module including an image sensor and a light emitting diode flash mounted to a common carrier, the reflowable camera module optically isolating the image sensor from the flash;
- and
- using a solder reflow process to mount the reflowable camera module to a motherboard.
Dependencies are inferred from the claim text.