Imaging module package
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsSTEVEN WEBSTER, YING-CHENG WU, SHUO-WEI HUANG, SHIH-MIN LO
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Abstract
An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.
Claims11
An imaging module package comprising:
- a substrate defining an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof;
- an imaging sensor chip positioned in the upper chamber and electrically connected to the substrate;
- a functional unit positioned in the lower chamber and electrically connected to the substrate;
- a housing mounted on the top surface of the substrate and disposed above the imaging sensor chip;
- and
- a lens module positioned in the housing.
Dependencies are inferred from the claim text.