Method and system for controlling mems switches in an integrated circuit package

Abstract

Methods and systems for controlling MEMS switches in an integrated circuit package are disclosed and may include controlling one or more arrays of MEMS switches utilizing a control chip. The arrays of MEMS switches and one or more circuit components may be integrated in and/or on a multi-layer package. The control chip may be bonded to the multi-layer package. The circuit components may be coupled to the arrays of MEMS switches via electrical traces embedded in and/or deposited on the multi-layer package. The control chip may be flip-chip bonded to the multi-layer package. The MEMS switches may be actuated electrostatically or magnetically. The circuit components may include integrated circuits, inductors, capacitors, surface mount devices, and/or transformers.

Dependencies are inferred from the claim text.